The deal marks a huge business win for Samsung Electronics, as the Korean chip maker is struggling to seize new orders to compensate for the lost Apple contract chip making account to TSMC of Taiwan.

The Sanpdragon 835 is the latest and the most advanced in Qualcomm’s premium mobile SoC , a successor to Snapdragon 820 and 821. As the chip is now in production, it will be available on a wide variety of smartphone models starting in the first half of 2017.

Foundry chip making business is to just fabricate chips of others’ design. Samsung Electronics is now staking out the business as one of its main revenue source.

Samsung’s faster-than-expected ramp–up to the 10nm chip process technology was a big prize, too.

Compared to its 14nm FinFET predecessors, Samsung’s 10nm technology allows up to a 30% increase in area efficiency with 27% higher performance. It also consumes up to 40% less power.

Using 10nm FinFET, the Snapdragon 835 processor will offer a smaller chip footprint, giving OEMs more usable space inside upcoming products to support larger batteries or slimmer designs. Process improvements, combined with a more advanced chip design, are expected to bring significant improvements in battery life.

The decision to use Samsung’s 10-nanometer FinFET process technology in the next generation processor highlights Qualcomm Technologies’ continued dedication to maintain leadership from newcomers like Spreadtrum and HiSilicon of China and MediaTek of Taiwan.

“Using the new 10nm process node is expected to allow our Snapdragon 835 processor to deliver greater power efficiency and increase performance,” said Keith Kressin, senior vice president, product management, Qualcomm Technologies. Inc.