The company said that it has started the production in early January.

Fabricated with a 10nm 3D FinFET circuitry technology, the chip is embedded with 8 of Samsung’s custom designed 64bit central processing unit or CPU cores, ARM’s graphic processing unit Mali-G71, cache memory, and SCI interface technology.

With implementation of 10nm circuitry, the chips have 27% better performance and 40% less power consumption, compared with the predecessor fabricated with a 14nm circuitry technology.

What makes the chip stand out from competition is that it is built with heterogeneous system architecture or HSA technology, which makes two separate processing elements CPU and GPU cores to work in sync together seamlessly to maximize the chip performances.

Underlying the HSA architecture is Samsung’s own indigenous SCI, or Samsung Coherent Interconnect technology that allows CPU and GPU cores to intelligently share cache memory circuitry to boot up data whenever it is on demand.

For example, it can process computational power-hungry AI, or artificial intelligent and deep learning algorithm.

The chip also comes with a high-performance Multi Format Codec or MFC to support 4K applications, enabling smart phone users not only to play back and shoot 4K contents, but also play with VR and AR games.

The new mobile SoC is also integrated with LTE modem chip in what the company says is the first to adopt 5CA or carrier aggregation technology. The modem delivers LTE Category 16 download speeds of up to 1 gigabits per second, or Gbps and support LTE Category 13 upload speed of up to 150 megabits per second or Mbps.

The chip also comes embedded with VPU, or vision processing units and encrypted data processing units that can support machine vision recognition, which allows smart phone users to recognize and define visual objects. It can be used for growing biometric authentication for mobile payment service.