(iTers News) - Nordic Semiconductor is sampling the first member of its next generation nRF52 Series of ultra low power wireless solutions – the nRF52832 system-on-chip,or SoC, in what the chip maker said is the power-thriftiest and most powerful Bluetooth chip solution ever of its kind.

 

The nRF52832 is the first singe Bluetooth Smart SoC solution that integrates a RF transceiver and a baseband processor in a single die coming built with other analog and digital peripherals.

 

It also incorporates a unique on-chip NFC tag for consumer-friendly Touch-to-Pair function.

 

The rollout is to keep up with growing market requirements for strong performances and low power consumption Bluetooth chip solutions, as wearable and IoT devices are increasingly requiring longer battery life and faster data  transfer or access.

 

 

“Current single-chip Bluetooth Smart solutions are struggling to keep up with the rate of innovation in Bluetooth Smart––the fastest growing wireless market in history––particularly in applications such as wearables and IoT,” says Thomas Embla Bonnerud, Nordic Semiconductor's director of product management.

 

“The main reason being that until now greater performance could only be achieved at the expense of power efficiency. The nRF52 Series uniquely merges barrier-breaking performance and power efficiency together on a Bluetooth Smart single chip for the first time, ” added he.

 

 SEAN CHOI/Country Manager-Korea/Nordic Semiconductor ASA/18 Jun 2015/seoul/JH Bae

The  nRF52832 integrates 64MHz ARM Cortex-M4F processor; 512kB Flash and 64kB RAM; a best-in-class ultra high performance, ultra low power multi-protocol Bluetooth Smart, ANT, and proprietary 2.4GHz radio with -96dB RX sensitivity, 5.5mA peak RX/TX currents, and an on-chip RF Balun in to a single silicon die.

 

Its built-in fully-automatic power management system also helps achieve optimal power consumption. Fabricated with a cutting-edge 55nm process, the nRF52832 comes in 6 x 6mm QFN and miniature 3.0 x 3.2mm CSP packaging options.

 

The nRF52832 also includes a full range of on-chip analog and digital peripherals for glueless interfacing to external components such as sensors, displays, touch controllers, LEDs, keypads, motors, digital microphones, and audio Codecs.

 

Applications are widely ranging from wearables to human interface devices such as remote controllers, toys, smart home devices and appliances, and wireless charging.

 

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The  EEMBC 215 CoreMark score shows that the nRF52832 delivers up to 60% more generic processing power, and an  additional 10 times more Floating Point and 2 time more DSP performance, compared to current ARM Cortex-M0/M3 based Bluetooth Smart SoC solutions.

 

And at 90 CoreMark/mA the SoC is up to 2X as power efficient as competing solutions.

 

 

The nRF52832’s higher processor performance enables developers to make their products more attractive to consumers, including adding new features and improving the user experience.

 

The single-chip integration translates into smaller form factor and lower BOM.

 

The increased power efficiency supports greater battery life, so that it can live long on smaller, lighter batteries, or an energy-harvesting system.

 

Its best-in-class radio performance supports up to 2X the connection reliability, robustness to interference, range, and data throughput––all minimizing packet loss and tech support issues––plus greater network topology and protocol complexity, and advanced security features.

 

“With the launch of the nRF52832, the first member of our nRF52 Series, we are completely pushing the envelope for what’s possible with single-chip Bluetooth Smart,” continues Bonnerud. “Applications that require the sort of processing power and performance that we now pack into this chip have until now had to use a two-chip solution as there was previously no Bluetooth Smart single-chip alternative.”

 

“The Nordic Semiconductor nRF52832 is the single chip the Bluetooth Smart market is crying out for and we hope it will free developers to be even more creative when developing Bluetooth Smart products and applications.”

 

Development Kits, QFN samples, software and documentation are available today. Volume production is scheduled to start by December 2015.

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