(iTers News) - As chip and display panel markets are riding upward cycles, so are semiconductor fab equipment makers that sit together at the second bottom layer of the manufacturing pyramid.

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Cases are point: EXICON has signed a 2.8 billion won deal to supply semiconductor fabrication equipment for Samsung China Semiconductor Co., Ltd.

Top Engineering Co., Ltd officially has seized a 3.29 billion won deal to supply display panel equipment for Shenzhen China Star Optoelectronics Technology Co., Ltd. or CSOT.

MIRAE CORPORATION officially announced that it has hit a 2.9billion won deal to supply display panel equipment for Shenzhen CSOT. The company also posted that it won 11.72billion won deal to supply display equipment for Interface Technology (Cheng Du) Co., Ltd.

TERA SEMICON has officially posted that it has net a 42.9 billion won deal to supply semiconductor fabrication equipment for an undisclosed chip maker.

DE&T Co., Ltd. officially announced that it has gained a 19.88 billion won deal to supply display panel equipment for an undisclosed display maker.

FNS TECH Co., Ltd officially announced that it has signed a 24.5 billion won deal to supply OLED panel equipment for an undisclosed display maker.

LOTVacuum Co., Ltd. has officially announced that it has signed a 4.79billion won deal to supply its dry vacuum pump for Samsung Electronics.

TECHWING officially announced that it has seized 1.62billion won deal to supply semiconductor inspection or testing equipment for SanDisk.

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