According to the reports, Samsung temporarily stopped the construction of the 12-inch wafer fab that had been under way since June at its mammoth Hwasung semiconductor fabrication cluster on uncertain outlook for 2013 SOC markets.
Yet, Samsung PR officer said that the chipmaker hasn't make any official decision to stop, or postpone the investment plan at least for now, and will keep going ahead with the original plan.
Looking forward, however, how global market will evolve in 2013 will determine its future decision on where to go or not.
With a total of 2.25 trillion won earmarked, Samsung broke ground for the 12-inch wafer fabrication facility in June 2012 to churn out SOC solutions like applications processor chips for smartphones and tablet PCs starting by the end of 2013.
The 12-inch wafer fab was scheduled to adopt the chipmaker's yet undeveloped 14nm and 20nm manufacturing process to roll out APs.