Tongfu Microelecronics of China has been flexing its engineering muscle to the extent that it can live up to its ambition to join the who’s who lists of global top-tier packaging companies. 

The efforts culminated in its successful packaging implementation of microprocessor chip maker AMD’s 7nm circuitry EPYC processor in what the company said is the world’s first chip packaging of 7nm –wide circuitry CPU. 

The Chinese chip packaging company has credited that achievement to its well-managed acquisition and merger strategy, which allowed it not only to acquire stakes in AMD’s two offshore packaging subsidiaries, but also buy their knowhow and expertise. 

Tongfu bought out 80% stakes each in AMD’s Penang, Malaysia chip packaging subsidiary and Suzhou, China subsidiary to establish TF-AMD Suzhou and TF-AMD Penang.

Not only the equity acquisition has enabled the Chinese company to scale up its chip-packaging expertise and capacity for CPUs and GPUs , but also to win an order from AMD in what’s called as a win-win strategy. 

Established in 1997, Tongfu Microelectronics is one of the Chinese top three chip packaging companies that is operating 6 chip packaging facilities in China and Malaysia.