The one-year interval is in sync with Intel’s catch-up drive to expand its Atom mobile microprocessor ecosystem, because the smaller chip size translates into higher clock speed, lower manufacturing costs, and more importantly lower power consumption- the most important value proposition in mobile CPU market.
The PC CPU titan also detailed its Atom processor roadmap, announcing that it will ship samples of Atom™ Z2580 processor, a successor of Atom Z2460 codename Medfield in the second half of this year.
The Z2580 chip solution double the performance of the Atom processor Z2460, of which clock speed runs up to 2GHz and features an advanced multimode LTE/3G/2G solution. The commercial version of the Z2580 for customers will be shipped in the first half of 2013.
Low-cost smartphone markets in emerging economies such as China and India are also where Intel is now refocusing on to seize back market leadership. To tap into just fledgling, but fast-growing smartphone market in emerging economies where consumers look for more value at lower prices, Intel disclosed plans for the Intel® Atom™ processor Z2000.
The Z2000 is aimed squarely at low cost smartphone market segment of less than US$100 before subsidies, which industry sources predict could reach up to 500 million units by 20151.
The platform includes a 1.0 GHz Atom CPU offering great graphics and video performance, and the ability to access the Web and play Google Android* games.
It also supports the Intel® XMM 6265 3G HSPA+ modem with Dual-SIM 2G/3G, offering flexibility on data/voice calling plans to save on costs. Intel will sample the Z2000 in mid-2012 with customer products scheduled by early 2013.
In 2011, Intel shipped in more than 400 million cellular platforms, according to CEO Paul Otellini.
Building on this successful market penetration, Intel announced the XMM 7160, an advanced multimode LTE/3G/2G platform with support for 100Mbps downlink and 50Mbps uplink, and support for HSPA+ 42Mbps.
Intel will sample the product in the second quarter with customer designs scheduled to launch by the end of 2012.
Intel also announced that it is sampling the XMM 6360 platform, a new slim modem 3G HSPA+ solution supporting 42Mbps downlink and 11.5Mbps uplink for small form factors.
By Don Jiang