Barcelona, Spain (iTers News) – Just a couple of weeks after it was acquired by ST Telecom, Korea’s largest telecom service carrier, Hynix Semiconductor Inc. gives a first clue to how the chip maker will carve out its future by synergizing its expertise in mobile memory chip solutions with SK Telecom’s marketing and technological prowess in mobile phone business

The world’s second largest memory chip maker today debuts a series of ‘Smart Mobile Solution’ products at Mobile World Congress (‘MWC’) 2012 that runs from February 27 through March 1 in Barcelona, Spain.

The world’s second largest memory chip maker joined its parent company SK Telecom to make the first presence ever at this world’s largest mobile industry trade show.

Under the marketing catchphrase of ‘Hynix enabling a ubiquitous world’, Hynix shows off a series of mobile solutions including 20nm class 4Gigabit (‘Gb’) DDR3 DRAM and 30nm class 4Gb LPDDR3 DRAM.

The chipmaker also debuts a series of memory chip solutions, which are specifically designed and developed for infotainment systems of a smart.



Cut a path to a 20nm class scaling

The newly developed 20nm class 4Gb DDR3 DRAM is targeting high density applications such as high-end virtualized servers, datacenter servers and high performance tablet and ultrabooks, satisfying JEDEC standard.

The product offers maximum data transfer speed of 2133Mbps (Megabits per second) or 4.3 GB/s (Gigabytes per second) bandwidth with a 16-bit I/O, supporting the ultra low voltage operation of 1.25V.

It saves more than 40% power consumption than the existing 30nm class products. In terms of production efficiency, it is increased by more than 60% over the 30nm class process technology.

According to a market research firm, iSuppli, demand for 2Gb DDR3 is expected to gradually decline after it hit a peak in this year with 78% of bit shipments, while 4Gb DDR3 is expected to become a mainstream.

Hynix plans to start volume production of the new 20nm class 4Gb DDR3 DRAM in the first half of 2012.

High density of 64Gigabyte (‘GB’) modules for the cloud computing market will be also added to our portfolios.

30nm class LP DDR3 up the sleeve

The company also introduced newly produced 30nm class 4Gb LPDDR3 DRAM which are customized for the high-end smartphone, tablet and ultrabook PCs.

This product provides MCP (Multi Chip Package) and PoP (Package on Package) platforms.

Hynix meets customer needs with its 8Gb (1GB) and 16Gb (2GB) density products which contain two layers and four layers respectively.

It boasts maximum operating speed of 1,600Mbps at 1.2V power supply, and processes up to not only 6.4GBps with a 32-bit I/O, but also 12.8GBps with dual channel configuration.

While this product not only maintains the same standby power consumption with LPDDR2, it also provides high speed operation up to 50% of improvement, which enables to support low power and high performance solutions.

With its great performances, the product well befits mobile applications, as they meet almost all JEDEC standard.

According to the iSuppli, due to increasing requirement of high performance mobile DRAM, the demand for LPDDR3 is expected to shot up by 56% in 2015 and LPDDR3 as a mobile DRAM will become the mainstream.

“Hynix has a variety of mobile products which satisfy requirements of high density, high performance and low power consumption”, said Mr. Ji-Bum Kim, Chief Marketing Officer of Hynix.

“Hynix is able to provide competitive solutions to the mobile application market”, he added.

Hynix also introduced other mobile solutions including SSD (Solid State Drive) with density of 128GB~512GB and CIS (CMOS Image Sensor) as well.

In sync with Nvidia

On the spotlight were a series of new memory solutions aimed at car infotainment markets , including 30nm class 4Gb DDR3 consumer DRAM and eMMC (Embedded Multi Media Card or ‘e-NAND’) NAND Flash.

For years, Hynix has been in sync with NVIDIA, graphics processor and smartphone and tablet PC CPU makers to carve out new niches in car infotainment semiconductor market.

While Nvidia works on a car infotainment engine chip –Tegra series of applications processors for a smart car, Hynix is offering a series of memory solutions to work together with them.

At CES2012 held in last January, Hynix’s memory solutions were found embedded in several prestigious Germany brand cars.

The infotainment system, which integrates navigation, Internet, video, and location based services, is an evolution from the single function navigation systems currently installed in automobile.

The automobile industry sees major growth opportunities in smart cars with infotainment systems over the next few years.

This automobile semiconductor market is especially difficult to enter, however, because it requires higher reliability, quality condition and longer qualification process, which takes more than a year on average .

Hynix expects its presence in MWC 2012 trade show will not only expand its business scope into the smart mobile solution market, but also strengthen a relationship with its customers.

By Austin Jung

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