EXICON signs a deal to supply chip inspection and testing equipment for Samsung
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EXICON signs a deal to supply chip inspection and testing equipment for Samsung
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입력 2017.03.15 10:26
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(iTers News) - EXICON said that it has signed a 4.4 billion won deal to supply semiconductor chip inspection and testing equipment for Samsung Electronics. The equipment will be installed in Samsung’s Xian wafer fabrication facility located in China.