(iTers News) - SK Hynix unveiled its 8GB LPDDR4 mobile DRAM using dual channel 16Gb chips.

The roll is to seize the orders for 8GB mobile DRAM that will be built in global smartphone maker's next flagship smartphones.

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8GB is the highest density in the LPDDR4X standard, which has 20% of superiority in power efficiency to current LPDDR4. 

Data I/Os run at ultra-low voltage of 0.6V in the LPDDR4X compared to 1.1V in LPDDR4, having better power efficiency.

The 8GB LPDDR4X processes 34.1GB of data per second with 64-bit I/O.

Meanwhile, the chip has package size of 12mmX12.7mm, which is scaled down by more than 30% compared to an 8GB LPDDR4 with the thickness thinner than 1mm.

The Korean chip maker expects the product to be installed in a variety of mobile devices and optimize user conveniences with the virtue of the efficiency in battery use, the high performance, and the compactness.

“We aim to help mobile device users maximize their experiences” said Jonghoon Oh, senior vice president and the head of DRAM product development division at SK Hynix. “We also plan to expand the usage of the product to various applications such as high end laptops and automotive electronics as well as mobile gadgets.”

According to IHS Markit, the average memory size of high end smart phones will be 3.5GB in 2017 and grow up by 6.9GB in 2020.

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